INTRODUCTION TO MATERIAL SCIENCE
Fundamentals of materials science; Structure: Introduction to microstructure, and nanostructure; Introduction, importance and examples for nanomaterials, biomaterials, electronic, optical, and magnetic materials, ceramic and glass materials, composite materials, polymeric materials, metals and alloys; Introduction and applications of modern engineering materials: shape memory materials, chromic materials (thermo, photo, and electro chromic), rheological fluids, metallic glasses, advanced ceramics; Introduction and applications of Ferroelectricity and ferroelectric materials, Piezoelectricity and piezoelectric materials, pyro-electric materials.
ELECTRICAL PROPERTIES OF MATERIALS
Introduction; Measurement of electrical resistivity; Electrical conductivity: conductors, semiconductors, and insulators; Electronic conduction: energy band structures in solids, band and atomic bonding models (for metals, semiconductors, and insulators), drift velocity and electron mobility, factors influencing electrical resistivity of metals, intrinsic semiconduction, extrinsic semiconduction (n-type and p-type), carrier mobility, Hall effect; Semiconductor devices: rectifier and p-n rectifying junction (forward, and reverse bias), transistor, junction transistor and MOSFET; Conduction in ionic materials; Dielectric behaviour: Introduction to electric dipole, capacitance, polarization (electronic, ionic, and orientation); Supper conductors and their applications.
OPTICAL PROPERTIES OF MATERIALS
Absorbance and Transmittance: Introduction and measurement of absorbance by absorbance spectroscopy; Index of refraction and Abbe’s refractometer; Birefringence and birefrigent materials; Photosensitivity, Photoconductivity, and Photoresistivity; Reflectance and reflectivity, Scattering (Rayleigh, Mie, and geometric) and their applications; Luminescence: types and applications; Fluorescence and its applications; Photonic Materials: principle, and device construction; Liquid crystals and liquid crystal display: molecular orientations, sensitivity to electric field, LCD construction, operation; Photoconducting materials: photoconductive device, construction, materials used, and applications; Photodetectors: characteristics, charged coupled device; Photonic crystals: classification and applications.
THERMAL AND MAGNETIC PROPERTIES
Thermal Properties: Introduction; Heat capacity: specific, molar, and volume heat capacity, factors affecting specific heat capacity; Thermal expansion: factors affecting thermal expansion, coefficient of thermal expansion, importance, and applications of thermal expansion property (bimetal, and mercury-in-glass thermometer); Thermal conductivity: Fourier’s law, thermal conductance, resistance, transmittance, and admittance, factors affecting thermal conductance.
Magnetic Properties: Magnetic materials, angular momentum; definitions of magnetic dipole, dipole moment, flux, flux density, field strength, magnetization, susceptibility, permeability, relative permeability, Bohr Magneon; Classification of magnetic materials: diamagnetic, paramagnetic, ferromagnetic, antiferromagnetic, and ferrimagnetic materials; Hard and soft magnetic materials: comparison, properties and applications; Introduction and applications of Garnets, Magnetoplumbites, Magnetic bubbles, and Magnetic thin films; Spintronics and devices: OMR, GMR, TMR, CMR, advantages, and applications.
DEFECTS AND IMPERFECTIONS & MECHANICAL PROPERTIES OF MATERIALS
Defects and Imperfections: Point defects: vacancies, interstitialcy, Schottky defect, Frankel defect, and impurity defects; Line defects: edge dislocation, screw dislocation, Burger’s vector, cross slip of a screw dislocation, climb of an edge dislocation; Surface imperfections: grain boundary, tilt boundary, twin boundary.
Mechanical Property of Materials: Mechanism of elastic action; UTM: Components; Tensile strength, and compression strength: Introduction, concept, testing procedure; Engineering stress and strain, true stress and strain, linear and non-linear elastic properties; Relationship between engineering strain and true strain, engineering stress and true stress; Hardness: Brinell, and Rockwell hardness tests; Fracture: ductile and brittle fracture; Fatigue: mechanism of fatigue; Creep: various stages of creep; Impact strength: Izod and Charpy impact strength tests.