a) What are smart-material systems? Evolution of smart materials, structures and systems. Components of a smart system. Application areas. Commercial products. b) What are microsystems? Feynman’s vision. Micromachined transducers. Evolution of micro-manufacturing. Multi-disciplinary aspects. Applications areas. Commercial products.
a) Definitions and salient features of sensors, actuators, and systems. b) Sensors: silicon capacitive accelerometer, piezo-resistive pressure sensor, blood analyzer, conductometric gas sensor, fiber-optic gyroscope and surface-acoustic-wave based wireless strain sensor. c) Actuators: silicon micro-mirror arrays, piezo-electric based inkjet print- head, electrostatic comb-drive and micromotor, magnetic micro relay, shape- memory-alloy based actuator, electro-thermal actuator. d) Systems: micro gas turbine, portable clinical analyzer, active noise control in a helicopter cabin.
a. Silicon wafer processing, lithography, thin-film deposition, etching (wet and dry), wafer-bonding, and metallization. b. Silicon micromachining: surface, bulk, moulding, bonding based process flows. c. Thick-film processing: d. Smart material processing: e. Processing of other materials: ceramics, polymers and metals f. Emerging trends.
a. Scaling issues. b. Elastic deformation and stress analysis of beams and plates. Residual stresses and stress gradients. Thermal loading. Heat transfer issues. Basic fluids issues. c. Electrostatics. Coupled electromechanics. Electromagnetic actuation. Capillary electro-phoresis. Piezoresistive modeling. Piezoelectric modeling. Magnetostrictive actuators.
Background to the finite element element method. Coupled-domain simulations using Matlab. Commercial software.
Carrier concentrations, semiconductor diodes, transistors, MOSFET amplifiers, operational amplifiers. Basic Op-Amp circuits. Charge-measuring circuits. Examples from microsystems. Transfer function, state-space modeling, stability, PID controllers, and model order reduction. Examples from smart systems and micromachined accelerometer or a thermal cycler.
Integration of microelectronics and micro devices at wafer and chip levels. Microelectronic packaging: wire and ball bonding, flip-chip. Low- temperature-cofired-ceramic (LTCC) multi-chip-module technology. Microsystem packaging examples.
BEL pressure sensor, thermal cycler for DNA amplification, and active vibration control of a beam.